hybrid packaging

英 [ˈhaɪbrɪd ˈpækɪdʒɪŋ]

美 [ˈhaɪbrɪd ˈpækɪdʒɪŋ]

网络混合封装; 混合组装; 混合集成电路封装

Large Area Hybrid& An Advanced Microelectronic Packaging Concept
大面积混合电路&一种先进的微电子组装概念
Development of epoxy/ epoxy-silsesquioxane hybrid material for LED packaging
LED封装用环氧树脂/环氧倍半硅氧烷杂化材料的研制
In traditional hybrid integrated circuit, the surface of Kovar packaging case is usually plated with Ni-Au.
混合集成电路中，封装一般采用表面电镀镍金可伐外壳。
The size and volume fraction of silicon carbide particle in hybrid C/ SiC_p per-form were designed, and hybrid 2D-C/ Al electronic packaging composites of non-wetting system were fabricated by low pressure infiltration.
设计了混杂C/SiCp预制型中碳化硅颗粒的尺寸及体积分数，并用低压浸渗技术制备了非润湿体系混杂2DC/Al电子封装复合材料。
A hybrid method using the genetic algorithm ( GA) and the error back propagation ( BP) algorithm to train structural neural networks is presented and applied to the identification of nonlinear characteristics of packaging cushioning in this paper.
提出了一种将遗传算法和BP算法相结合的关于结构化神经网络的混合训练方法，并将其用于解决包装件缓冲垫层非线性特性识别问题。
A Hybrid Evolutionary Neural Network Method in Identifying Nonlinear Characteristics of Packaging
包装件非线性特性识别的进化神经网络混合方法